炬光科技(688167.SH):公司泛半導體制程業務整體增長趨勢不會改變
格隆匯3月8日丨炬光科技(688167.SH)於2023年2月1日-3月2日通過電話會議、接受機構現場參觀時表示,公司利用自身在上游“產生光”和“調控光”的技術優勢,在泛半導體制程領域提供中游解決方案,專注大規模、大幅面加工應用場景,主要包括集成電路晶圓退火製程(邏輯芯片、存儲芯片、功率器件)、顯示面板領域的激光剝離、激光退火製程、MicroLED巨量焊接製程、鋰電池乾燥等應用場景。泛半導體制程業務的客户主要是激光設備集成商。
據公司從相關信息查詢小結,邏輯芯片晶圓退火全球存量市場200~300台,增量市場每年約30~50台;IGBT功率器件退火全球存量市場近千台,每年增量上百台;存儲芯片退火全球存量市場約100~150台,每年增量市場約20~30台;顯示面板激光剝離(LLO)國內舊線改造潛力30~50台;MicroLED巨量焊接市場容量約數百台;鋰電池激光乾燥應用市場容量約數千台。公司針對上述不同應用分別提供激光系統、光學系統等中游解決方案,價值量在幾十萬~幾百萬到幾千萬不等。
公司對泛半導體制程業務未來幾年的發展充滿信心,當然,由於韓國併購項目的終止,可能導致部分業務的落地與併購成功的情況相比可能會有所放緩,但是公司泛半導體制程業務整體增長趨勢不會改變。
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