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沃格光電(603773.SH):全玻璃結構方案目前已獲得著名客戶認可

格隆匯8月14日丨沃格光電(603773.SH)在投資者互動平臺表示,玻璃基在半導體先進封裝應用,對現有封裝基板材料的升級方案主要有玻璃基和ABF/PI,玻璃基封裝到PCB,以及全玻璃多層堆疊方案,其中全玻璃基多層堆疊方案技術難度極高,需要多層超薄玻璃基雙面線路板進行玻璃鍵合,包括核心裝備開發等。全玻璃結構方案目前已獲得著名客戶認可,沃格光電在該產品的技術儲備、設備能力位於行業絕對領先,是全玻璃基線路板行業的引領者。目前通格微公司在上述多種結構和方案順利推進和協助上下遊產業鏈進入產業化應用,終端應用場景包括光模塊/CPO、存儲、邏輯推理、自動駕駛、機器人、6G通訊等多個領域。此外,湖北通格微多層GCP(玻璃線路板)產品在Micro LED直顯(家居智能顯示以及近距離顯示等)、6G通訊等多項領域均有項目開發和應用,並形成一定研發收入。上述應用場景主要爲技術突破實現的新市場增量,替代現有技術路徑方案,市場空間極大。

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