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財信證券:關注PCB中具有更高增速及壁壘的細分領域

財信證券研報指出,全球PCB市場有望迎來複蘇,高多層板、HDI板、封裝基板有望在中長期保持較高增速。根據月度數據判斷,預計行業正温和復甦,建議關注PCB中具有更高增速及壁壘的細分領域。1)數通板:全球通用人工智能技術加速演進,AI服務器及高速網絡系統的旺盛需求對大尺寸、高速高多層板的需求推動有望持續,關注:滬電股份、深南電路等。2)汽車板:汽車行業電氣化、智能化和網聯化等技術升級迭代和滲透率提升將為多層、高階HDI、高頻高速等方向的汽車板細分市場提供強勁的長期增長機會,關注:世運電路、勝宏科技等。3)消費電子領域:下半年通常為消費電子旺季,疊加蘋果發力端側AI,消費電子領域PCB有望迎來增長,關注:鵬鼎控股等。4)封裝基板:半導體國產化大勢所趨,關注:興森科技等。5)覆銅板:關注在高端產品不斷取得突破的公司生益科技等。

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