利揚芯片(688135.SH):擬使用募集資金向東莞利揚實繳前次出資並增資共計2.99億元
格隆匯7月24日丨利揚芯片(688135.SH)公佈,公司向不特定對象發行可轉換公司債券募投項目“東城利揚芯片集成電路測試項目”中的實施主體為公司全資子公司東莞利揚,擬使用募集資金向東莞利揚實繳前次出資並增資共計人民幣29,925.71萬元。公司於2023年4月經第三屆董事會第十九次會議審議通過,決議對東莞利揚增資20,000.00萬元(以下簡稱“前次出資”),其中5,000.00萬元作為實收資本,15,000.00萬元作為資本公積,該次增資完成後,東莞利揚註冊資本增加至15,000.00萬元。截至本公吿披露之日,前次出資尚有14,000.00萬元未實繳。為保證募集資金投資項目順利推進,本次計劃投入募集資金共計人民幣29,925.71萬元,其中14,000.00萬元擬用於繳足前次出資;15,925.71萬元擬用於對東莞利揚進行增資,本次增資擬全額計入資本公積,不增加東莞利揚註冊資本。本次增資完成後,東莞利揚仍為公司全資子公司。
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