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凸版印刷擬在新加坡建立半導體封裝基板廠 料創造200職位
阿思達克 03-14 11:20
日本印刷及原料商凸版印刷(Toppan Holdings)宣布,計劃在2026年底在新加坡建立半導體封裝基板廠;跟隨多家日本同業在人工智能(AI)相關需求激增下,擴大資本投資的步伐。 封裝基板是芯片封裝體的重要組成材料,主要起承載保護芯片與連接上層芯片和下層電路板作用。凸版印刷未有披露投資金額,但估算達500億日圓(約3.38億美元)。工廠料可創造200個職位,產能可以按需求提升,料未來總投資將超越1,000億日圓。 即使凸版印刷需承擔前期投資,但未來任何產能擴張安排,將會獲得其主要客戶博通(AVGO.US)的財政支持。 現時凸版印刷在其國內新潟廠房生產封裝基板,新規劃的新加坡工廠將會毗鄰許多後期加工分判商,處理馬來西亞及台灣的半導體組裝及測試。 依靠日本工廠及新加坡新工廠,凸版印刷目標至2027財年將整體封裝基板產能較2022財年擴大150%。 法國研究企業Yole Intelligence指,晶片封裝基板市場至2028年將達至290億美元,較2022年擴大90%。
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