壹石通(688733.SH):公司定增項目年產200噸高端芯片封裝用Low-α射線球形氧化鋁項目已進入產線調試階段
格隆匯11月20日丨壹石通(688733.SH)近日投資者關係活動記錄表顯示,公司董事長結合自身在Low-α射線二氧化硅領域的相關研究,設立壹石通公司,當時主要配合日本雅都瑪解決芯片封裝的問題,為其開發出Low-α高純二氧化硅產品,進而形成合作關係。Low-α球形氧化鋁是芯片封裝材料的進一步升級,公司目前已具備量產能力。產能方面,公司定增項目年產200噸高端芯片封裝用Low-α射線球形氧化鋁項目已進入產線調試階段,公司做好了產能儲備。不同型號的產品均已在客户端測試,但尚未收到批量訂單。
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