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三星擴大晶片製造業務 2025年起產移動晶片 力戰台積電
三星電子(Samsung Electronics)周三(28日)制定擴大晶片製造業務的路線圖,希望以追趕領先者台積電。目前人工智能晶片龍頭Nvidia(NVDA.US),依靠台積電等代工廠製造半導體。 三星目前有為高通(QCOM.US)等代工生產半導體。三星計劃於2025年開始大規模生產用於移動應用的2nm工藝,於2026年擴展至數據中心訓練和部署人工智能應用程序的高性能計算晶片領域,並於2027年擴展至汽車領域。 三星表示,正在繼續擴大其位於韓國平澤和美國德克薩斯州的工廠晶片製造能力。三星代工廠目前落後於台積電,據Counterpoint Research顯示,今年首季,台積電佔全球半導體代工收入59%,而三星僅佔13%。
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