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民德電子(300656.SZ):廣芯微電子項目正式實現投產通線,一期月產能預計最終可達到12~14萬片
格隆匯 05-23 10:30

格隆匯5月23日丨民德電子(300656.SZ)公佈,2023年5月19日,相關機構及人員到浙江廣芯微電子有限公司(“廣芯微電子”)和浙江芯微泰克半導體有限公司(“芯微泰克”)現場進行了參觀調研,民德電子董事長兼總經理許文煥、副總經理兼董事會祕書高健,廣芯微電子總經理謝剛、副總經理胡楊,芯微泰克董事長兼總經理義嵐,以及晶睿電子董事長兼總經理張峯等人在現場進行了接待。

上午舉行了芯微泰克項目主體廠房封頂儀式暨廣芯微電子項目通線儀式,下午參觀廣芯微電子生產廠房,隨後各方就項目情況進行了交流。

廣芯微電子項目概況:廣芯微電子公司成立於2021年10月,項目於2022年2月開始土建動工打樁,5月完成主體廠房封頂,12月首台設備進場,在2023年3月成功合環供電,經設備安裝調試,於2023年5月19日正式實現投產通線。一期月產能預計最終可達到12~14萬片,主要以6英寸代工產能為主,配有部分8英寸代工產能;以硅基產品為主,以碳化硅產品為輔。廣芯微電子項目的投產,將徹底打開公司功率半導體業務產能擴張的天花板,且後續產品開發效率方面會更加高效、可控。

2、芯微泰克項目概況:芯微泰克公司成立於2022年7月,當年9月項目完成建設用地摘牌,11月完成圖紙設計及各項評審工作,並開始正式動工建設,目前正在進行主體廠房等土建工程施工,預計2023年三季度通線。芯微泰克將專注於背道工藝,為功率器件設計公司和晶圓廠客户提供定製化的背面代工服務。屆時,廣芯微電子和芯微泰克將聯合為廣大設計公司提供高性能硅基及碳化硅功率半導體器件定製化代工+超薄片製程全套解決方案。

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