快克智能(603203.SH):擬投資約10億元建設半導體封裝設備研發及製造項目
格隆匯5月8日丨快克智能(603203.SH)公佈,為推動公司整體戰略佈局,積極發展公司半導體裝備業務,着力打造半導體封裝成套解決方案,快克智能擬與武進國家高新技術產業開發區管理委員會簽署《進區協議》,投資建設“半導體封裝設備研發及製造項目”(稱“項目”),項目計劃總投資約10億元。
公司投資建設半導體封裝設備研發及製造項目,是響應國家政策指引、順應產業發展趨勢、落實公司戰略規劃的重要舉措,擬進一步加強公司半導體裝備業務的研發創新能力及製造產能建設,着力打造半導體封裝成套解決方案,積極佈局先進封裝高端設備領域,提升公司品牌知名度和市場影響力,實現半導體業務板塊做大做強。
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