電連技術(300679.SZ)：相關基金以約2.1億元投資瓴盛科技
格隆匯1月28日丨電連技術(300679.SZ)公佈，此前披露，為響應國家號召，抓住當前集成電路產業重組整合的良機，通過產業項目投資，帶動產業鏈發展並創造良好的投資回報，公司與北京建廣資產管理有限公司、格科微電子(上海)有限公司、上海瓴煦企業管理中心(有限合夥)共同合作，投資設立了建廣廣輝(德州)股權投資管理中心(有限合夥)(“建廣廣輝”或“基金”)。建廣廣輝出資總額為人民幣227,378,712.50元，其中公司作為有限合夥人以自有資金出資人民幣21,643,410.64元，出資比例為9.5187%。該基金的投資標的為瓴盛科技有限公司(“瓴盛科技”)7.042%股權。
近日，公司收到基金執行事務合夥人北京建廣資產管理有限公司的通知，截至公吿日，各合夥人已按照合夥協議完成出資，基金已完成募集，並已投向瓴盛科技。
基金以現金的形式對瓴盛科技出資210,189,500元人民幣，佔瓴盛科技註冊資本的7.0425%。
瓴盛科技，主要從事智能物聯網、移動通信手機芯片及其衍生品的研發，下游應用行業主要為移動通信、物聯網、人工智能、的研發與整合，專注於設計和銷售以高通核心技術支持研發的蜂窩通訊和智能物聯網 SOC 芯片產品。
半導體芯片產業是信息技術產業的核心，是支撐經濟社會發展和保障國家安全的戰略性、基礎性和先導性產業，當前和今後一段時期是我國半導體芯片產業發展的重要戰略機遇期和攻堅期。瓴盛科技對標的行業緊緊圍繞泛5G未來的廣泛應用，具有非常好的產業前景，符合國家產業政策的鼓勵方向，有利於提升國家整體的半導體芯片的能力及水平。成立以來，瓴盛科技逐步積累了較多的客户，第一顆AIoT智聯網芯片已經量產，已經在國內的眾多頭部客户中應用，在AI視覺及物聯網應用的領域及智能手機SOC類型的芯片也即將發佈，這些產品陸續推出將極大提升瓴盛科技的市場空間及業務量。
公司的前端研發已經與國際知名的IC設計大廠有着較好的合作背景，在國產自主的產業政策背景引導下，借本次投資的機會，有利於公司擴大產品在國內、國外電子元件產業循環的規模，形成與瓴盛科技良性業務協同互動，有利於公司增強技術能力和水平，拓展海外優質客户的同時，拓展更多的行業應用，擴大業務的規模，豐富產品的類型及提升產品組件價值量。希冀在未來泛5G時代佔領更高更好的戰略制高點，提升公司的盈利能力和競爭力，促進公司業績可持續、穩定增長。
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