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New IPO: Interconnect Chip Leader Montage Technology Goes Public in Hong Kong
uSMART盈立智投 01-30 11:37

Montage Technology Co., Ltd. (6809.HK) has launched its Hong Kong IPO. The offering period will run from January 30 to February 4, 2026. The company plans to issue 65,890,000 H-shares, with an overallotment option of 15%. The highest issue price is set at HKD 106.89 per share, with a board lot of 100 shares, making the entry fee approximately HKD 10,796.80. The shares are expected to list on the Hong Kong Stock Exchange's Main Board on February 9, 2026. The joint sponsors for the offering are China International Capital Corporation (CICC), Morgan Stanley, and UBS.

Montage Technology: The World's Largest Supplier of Memory Interconnect Chips

Offering Breakdown: Approximately 10% of the offering (6,589,000 shares, subject to reallocation) will be available for Hong Kong public subscription, while around 90% (59,301,000 shares, subject to reallocation and the exercise of the overallotment option) will be allocated to international investors.

Issue Price: The maximum price is HKD 106.89 per share, with a minimum lot size of 100 shares, and an entry fee of around HKD 10,796.80.

Offering Period: January 30 to February 4, 2026 (Pricing Date: February 5, 2026).

Listing Date: February 9, 2026.

Sponsors: CICC, Morgan Stanley, UBS.

 

Company Profile

Montage Technology is a globally leading fabless integrated circuit design company, specializing in providing innovative, reliable, and energy-efficient interconnect solutions for cloud computing and AI infrastructure. According to Frost & Sullivan, by revenue, the company was the largest supplier of memory interconnect chips worldwide in 2024, holding a market share of 36.8%. Montage Technology offers a full range of DDR2 to DDR5 memory interface chips and supporting chips, as well as PCIe/CXL interconnect chips, widely used in data centers, servers, and computer terminals.

 

Financial Information

According to the prospectus, Montage Technology reported revenues of approximately RMB 3.672 billion, RMB 2.286 billion, and RMB 3.639 billion for the years 2022, 2023, and 2024, respectively. Net profits for the same periods were about RMB 1.299 billion, RMB 0.451 billion, and RMB 1.341 billion. For the nine months ending in September 2025, the company recorded revenue of RMB 4.058 billion and a net profit of RMB 1.576 billion. At the maximum issue price of HKD 106.89 per share, assuming no exercise of the overallotment option, the company expects to raise a net amount of approximately HKD 6.905 billion. The proceeds will be used for investment in interconnect chip R&D (about 70%), enhancing commercialization capabilities (about 5%), strategic investments and/or acquisitions (about 15%), and general working capital and corporate purposes (about 10%).

 

uSMART launches “HK IPO Fee-Waiver Offer” – subscribe to new shares at zero cost

Margin subscription: 0 % interest, leverage up to 10×

Cash subscription: HK$0 handling fee

Grey-market trading supported

* 0 % interest applies to margin subscription amounts of HK$20 million or below.

^ All handling fees are waived for cash subscriptions.

This promotion is effective from 5 December 2025 until further notice. Certain high-profile IPOs may be excluded. The actual interest rates and fees charged are those shown in the uSMART App subscription interface; statutory government and exchange levies will still apply. The company reserves the right to amend, suspend or terminate the above offer or its terms and conditions at any time without prior notice, and its interpretation shall be final.

How to Subscribe for Montage Technology via uSMART HK

The uSMART HK App features an IPO Centre with exclusive perks, allowing clients to subscribe instantly to public offerings. After logging into the app, tap "Trade" at the bottom-right, go to "IPO Subscription," select Montage Technology, tap "Public Offer," enter your subscription quantity, and submit your order.

(Image source: uSMART HK App)

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