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崇達技術(002815.SZ):尚未直接涉足COWOP封裝

格隆匯8月5日丨崇達技術(002815.SZ)在投資者互動平臺表示,公司控股子公司普諾威已建成 mSAP(改良型半加成法)工藝產線,並於 2023年9月正式連線投產。該產線聚焦於 RF 射頻類封裝基板、SiP 封裝基板、PMIC封裝基板、TPMS基板等高端應用領域。mSAP工藝已在量產線寬/線距 20/20 微米的產品,ETS埋線工藝的線寬/線距能力可達15/15微米,技術能力方面可滿足先進封裝基板的量產需求,目前搭配mSAP工藝製作的產品已在大批量出貨。公司現階段以先進封裝基板爲核心,通過 mSAP 工藝升級及客戶認證體系構建技術護城河。COWOP技術目前仍處於行業研發驗證階段,公司尚未直接涉足 COWOP 封裝,但在高精度 PCB 製造、先進封裝基板及 AI 服務器領域的積累,爲未來參與更高級別封裝技術整合提供了可能性。公司將持續跟蹤行業動態,結合市場需求與技術成熟度,適時評估技術延伸路徑。

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