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嘉元科技(688388.SH):重點佈局高頻高速電路用銅箔、高密度互連銅箔及特種功能銅箔

格隆匯7月30日丨嘉元科技(688388.SH)在互動平臺表示,公司在PCB銅箔領域的發展戰略主要圍繞高端化、差異化展開,重點佈局高頻高速電路用銅箔、高密度互連(HDI)銅箔及特種功能銅箔,以滿足AI、算力、5G等新興領域對高性能PCB的需求。公司持續深化“生產一代、儲備一代、研發一代”戰略,進一步加快各類高性能電解銅箔產品的研發和製造,強化與下遊客戶合作,推動高端電子電路銅箔的國產替代進程,開發契合市場趨勢的新產品,不斷豐富和優化產品結構,逐步提升高抗拉強度、高延伸率鋰電銅箔和高端電子電路銅箔等高附加值產品的佔比,有效提升產品品質,以技術創新提升產品競爭力與市場份額。在技術儲備方面,公司圍繞 AI 和算力應用領域積極佈局了高頻高速、低輪廓(VLP)、甚低輪廓(HVLP)、載體銅箔等高端應用產品。

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