港股科技板塊引動第三輪中國資產重估 中金力推聯想、中芯國際等
近日,2Q25公募基金持倉數據進入密集披露時間,數據顯示,電子板塊持倉穩中有升,通信板塊持倉環比提升較多。
具體而言,1)半導體倉位環比略降,但算力高景氣推升PCB持倉;2)消費電子板塊中,關稅不確定性致果鏈持倉下降;3)通信/安防持倉環比提升,光通信產業鏈再受海外算力利好。
年初 DeepSeek 行情驅動了年內第一輪中國資產重估行情,被 4 月關稅擾動打斷後,5 月以來的資產重估由金融、消費和醫藥等板塊主導,並推動恆生指數回到 24000 點。在經歷了較快上漲後,三季度負面壓力"如期而至",但近期邊際變化顯示壓力程度比市場預期更加溫和。在景氣修復和估值性價比的交集中,港股科技板塊是佔整個港股市場接近 1/3 的大容量板塊,市場多數觀點認爲,關注科技重估驅動的第三輪中國資產重估行情。
邏輯在於,近期壓制科技類企業盈利前景的負面因素有所改善。1)"外賣大戰"對頭部互聯網企業的利潤壓力或提前緩解。18 日市場監管總局對主要外賣平臺公司進行約談,要求外賣平臺企業理性競爭。此前市場預期該競爭或持續至25 年底至 26 年。2)AI 行情出現新催化。上週美方批準英偉達向中國銷售H20 芯片,有望進一步提升國內企業資本開支速度,疊加 Kimi K2 開源等重要事件,AI 行情出現新催化。
展望 2025 年下半年,港股市場下半年有望再創新高。中金公司力推三大板塊:
半導體及元器件:需求增長明確,AI 飛輪已形成正循環;海外大模型廠商資本開支計劃明確、國內模型迭代加速,雲端算力需求高增,同時端側 AI 硬件創新拉動相關芯片需求,預計下半年生成式 AI 技術有望深化滲透;疊加供給側競爭格局改善以及國產替代加速推進,有望共同構築半導體及元器件行業成長動能。行情端,預計結構性機會是主導,推薦偏左側週期向上板塊,以及受 AI 應用落地、AI 硬件驅動較強的板塊。
個股推薦:恆玄科技、瑞芯微、深南電路、中芯國際A/H、華虹半導體
消費電子:關注端側 AI 硬件升級趨勢。端側 AI 多類終端創新加速落地並逐步下沉,部分環節漸進式升級或將引領消費電子行業成長,建議關注 AI 手機硬件升級及加速滲透、AI 可穿戴新終端形態的創新、光學行業重啓升規升配三大投資機會。
個股推薦:藍思科技、工業富聯、舜宇光學、華勤技術和高偉電子
通信/安防:海內外算力需求有望持續利好光通信等算力基礎設施。中金建議關注:1)AI大模型向多模態方向演進,關注推理落地,驅動雲端硬件需求保持高景氣;2)國產算力提速;3)運營商資本開支平穩,關注 5GA、骨幹網升級等結構性機遇。
個股推薦:聯想集團、中際旭創、銳捷網絡、光迅科技、移遠通信。
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