興森科技(002436.SZ):CSP封裝基板產能擴產主要系受益於近期存儲行業復甦和消費電子行業需求回暖
格隆匯7月7日丨興森科技(002436.SZ)在投資者互動平臺表示,公司IC封裝基板爲芯片封裝的原材料,主要配套CPU、GPU、FPGA、ASIC、存儲芯片等領域。公司CSP封裝基板產能擴產主要系受益於近期存儲行業復甦和消費電子行業需求回暖,公司訂單向好。公司與具體客戶的合作內容不便披露,產品的應用領域由客戶根據自身需求確定。
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