聯得裝備(300545.SZ):在先進封裝製程和第三代半導體相關設備領域,在市場和技術等方面,公司也正在佈局拓展
格隆匯7月4日丨聯得裝備(300545.SZ)在投資者關係表示,公司目前在半導體行業領域的設備主要集中在芯片封裝測試設備領域,主要有顯示驅動芯片
COF
倒裝機、半導體倒裝機、軟焊料固晶機、共晶固晶機、貼膜機、引線框架檢測機等高速高精的半導體裝備。在先進封裝製程和第三代半導體相關設備領域,在市場和技術等方面,公司也正在佈局拓展。公司將持續加大對半導體的研發投入,進一步完善新業務板塊產業佈局,推動公司半導體設備業務板塊的發展。
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