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科技股7月開門紅?光刻機、芯片齊“躁動”!

7月第一天,A股科技板塊迎開門紅。

今日,芯片產業鏈開盤集體起舞光刻機、光刻膠、先進封裝等方向領漲,不過盤中衝高後又回落。

截至發稿,凱美特氣2連板,海立股份、旭光電子漲停,藍英裝備漲超16%,久日新材漲超5%。

半導體、芯片概念掀漲停潮。

誠邦股份4連板,三超新材、旋極信息、鍇威特、快克智能、同興達、旭光電子、銀寶山新等十餘股漲停。

6月下旬以來,光刻機板塊持續走高,近7個交易日累計漲幅超11%;半導體板塊累漲超7%。

市場突傳重磅?

近日,市場傳聞稱國產EUV光刻機有重大突破。

此外還有媒體報道,國家集成電路產業投資基金三期正在調整重點,旨在解決光刻機和EDA軟件等關鍵短板。

不過目前官方尚未就此發佈正式公告,市場的情緒倒是愈發持續高漲起來。

拉長時間維度看,這輪行情最初始於6月下旬外圍傳來半導體行業新變數。

據悉,美國計劃撤銷臺積電、三星等全球主要半導體製造商在華技術豁免。

自特朗普打響關稅貿易戰來,中美科技博弈加劇,也加速推進着國產替代。

從政策端看國家安全部早前發文稱,科技自立自強是國家強盛之基、安全之要;科技興則民族興,科技強則國家強。

6月27日的國常會指出,要進一步增強責任感緊迫感,錨定目標不鬆懈,以“十年磨一劍”的堅定決心,加快推進高水平科技自立自強。

會議強調圍繞“補短板、鍛長板”加大科技攻關力度,加快突破關鍵核心技術,牢牢把握髮展主動權。

市場空間來看相關數據顯示,2024年中國大陸半導體晶圓製造設備市場規模達2300多億元,達到歷史高點,同比增長19.4%。

此外,2024年中國晶圓製造設備綜合本土化率達25%,其中清洗、CMP、PVD設備本土化率超35%。

SEMI預計,2025年國產芯片設備自給率將達50%,14nm工藝實現全覆蓋,初步擺脫對美日歐設備的依賴。

國產替代前景廣闊

受人工智能領域強勁勢頭推動,摩根大通此前指出,亞洲科技股今年有望再漲15%-20%。

該行甚至高呼,未來三個月不建議大幅減持AI概念股。

民生證券指出,目前全球前道光刻機被ASML、尼康、佳能壟斷。

從市場結構來看,高端EUV、DUV光刻機市場規模不斷提升,而i-line光刻機需求量依然較大,若能在部分品類實現國產化突破,市場空間十分廣闊。建議持續關注光刻機產業鏈相關零部件上市公司。

天風證券認爲,國內半導體行業正掀起併購熱潮,產業鏈多領域企業紛紛佈局收併購計劃,推動行業加速邁向新階段。

併購覆蓋半導體材料、設備、EDA、封裝、芯片設計等各個領域,典型案例如華大九天收購芯和半導體、海光信息吸收合併中科曙光、北方華創收購芯源微等。

企業通過橫向併購擴大規模、縱向併購完善產業鏈,國內半導體產業格局在重塑。對企業而言,併購是快速獲取關鍵技術、保持市場競爭力的核心手段。

在國產替代加速的大背景下,通過與擁有核心技術的企業合併,可顯著縮短與海外巨頭的技術差距,同時還能借此擴充產品品類、完善產業鏈佈局、實現規模效應。

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