至純科技(603690.SH)半導體濕法設備可以用於HBM高帶寬存儲芯片的生產製造
格隆匯6月16日丨至純科技(603690.SH)在互動平台表示,公司半導體濕法設備可以用於HBM高帶寬存儲芯片的生產製造。公司半導體濕法設備聚焦晶圓製造的前道工藝,主要應用於擴散、光刻、刻蝕、離子注入、薄膜沉積等關鍵工序段前後,能夠覆蓋晶圓製造中包括邏輯電路、高密度存儲、化合物半導體特色工藝等多個細分領域的市場需求。目前濕法設備在28納米節點設備開發已經全部完成,且全工藝機台均有訂單,在更先進製程節點,至微也已取得部分工藝訂單,尤其在高温硫酸、FINETCH、單片磷酸等尚被國際廠商壟斷的機台,公司交付和驗證進度都在國內領先。核心客户均為行業一線集成電路製造企業。
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