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德邦科技(688035.SH):產品種類多,市場覆蓋面廣,涵蓋人行機器人、智能家居、電子消費品等領域

格隆匯5月13日丨德邦科技(688035.SH)在投資者互動平臺表示,1)隨着人工智能、5G、雲計算、智能駕駛等新興技術的蓬勃發展,對芯片性能的要求不斷提高,推動了芯片設計和製造技術的持續進步,爲封裝材料企業帶來了發展機遇,直接帶動了電子封裝材料的市場需求增長,同時也對封裝材料各方面性能提出了更多要求,例如:高可靠性、高熱導率、良好的電氣性能、翹曲控制等。 2)公司產品種類多,市場覆蓋面廣,涵蓋人行機器人、智能家居、電子消費品等領域,公司聚焦集成電路封裝、智能終端封裝、新能源應用、高端裝備應用四大應用領域,秉持以市場爲導向、以客戶爲中心、以創新爲驅動的理念,持續進行技術升級和產品線完善,不斷加強產品推廣和綜合服務能力,持續推行大項目、大客戶戰略,鞏固和拓展市場份額。

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