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德邦科技(688035.SH):相關產品中共型覆膜主要用於PCB密封保護

格隆匯5月13日丨德邦科技(688035.SH)在投資者互動平臺表示,1)公司集成電路封裝材料主要包括芯片級封裝系列產品、晶圓級封裝系列產品、板級封裝系列產品。其中,板級封裝系列產品主要用於印製電路板(PCB)封裝工藝中的結構粘接、保護、導熱、導電,產品包括導熱墊片等導熱界面材料、SMT貼片膠、板級底部填充膠、共型覆膜等。 2)上述產品中共型覆膜主要用於PCB密封保護,公司產品具備較佳的耐高溫、高溼、耐鹽霧性能,能夠保護電子元器件不受熱衝擊、潮溼、腐蝕性液體和其它不利環境的影響,可以提升電子元器件可靠度和壽命,目前主要用於TWS耳機內部PCB防護工藝中。

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