飛凱材料(300398.SZ):生產銷售的EMC環氧塑封料,是存儲芯片製造技術所需要的材料之一
格隆匯5月13日丨飛凱材料(300398.SZ)在投資者互動平台表示,公司有生產應用於半導體制造及先進封裝領域的光致抗蝕劑及濕製程電子化學品如顯影液、蝕刻液、剝離液、電鍍液等,其中i-line以及Barc光致抗蝕劑配套材料可用於芯片製造領域。此外,公司生產銷售的EMC環氧塑封料,是存儲芯片製造技術所需要的材料之一,公司相關產品主要應用於封裝和分 立器件兩個領域。同時,公司發佈的Ultra Low Alpha Microball(超低阿爾法微球),依靠其最小直徑低至50μm,不僅填補了國內行業空白,更是直擊先進封裝用基板的“卡脖子”難題,被評為上海市高新技術成果轉化項目,為芯片高密度、高性能封裝提供了關鍵支撐。
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