深南電路(002916.SZ):公司FC-BGA封裝基板現已具備20層及以下產品批量生產能力
格隆匯5月12日丨深南電路(002916.SZ)在投資者關係表示,公司FC-BGA封裝基板現已具備20層及以下產品批量生產能力,各階產品相關送樣認證工作有序進行。20層以上產品的技術研發及打樣工作按期推進中。
公司廣州封裝基板項目一期已於2023年第四季度連線,產品線能力持續提升,產能爬坡穩步推進,已承接BT類及部分FC-BGA產品的批量訂單,但總體尚處於產能爬坡早期階段,由此帶來的成本及費用增加,對公司利潤造成一定負向影響。得益於各類訂單逐步投入生產,廣州封裝基板項目在2025年第一季度虧損環比已有所收窄。
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