士蘭微(600460.SH)：第Ⅳ代SiC芯片與模塊已送客戶評測，基於第Ⅳ代SiC芯片的功率模塊預計將於2025年上量
格隆匯4月8日丨士蘭微(600460.SH)公佈，2024 年，公司加快推進 SiC芯片技術研發及量產，具體進展如下：
2024 年，公司加快推進“士蘭明鎵 6 英寸 SiC 功率器件芯片生產線”項目的建設。截至目前，士蘭明鎵已形成月產 9,000 片 6 寸 SiC MOS 芯片的生產能力。基於公司自主研發的Ⅱ代 SiC-MOSFET 芯片生產的電動汽車主電機驅動模塊在 4 家國內汽車廠家累計出貨量 5 萬隻，客戶端反映良好，隨着 6 寸 SiC 芯片生產線產能釋放，已實現大批量生產和交付。目前，公司已完成第Ⅳ代平面柵SiC-MOSFET 技術的開發，性能指標接近溝槽柵 SiC 器件的水平。第Ⅳ代 SiC 芯片與模塊已送客戶評測，基於第Ⅳ代SiC芯片的功率模塊預計將於2025年上量。
同時，公司加快推進“士蘭集宏 8 英寸 SiC 功率器件芯片生產線”項目的建設。截至 2024 年底，士蘭集宏 8 寸 SiC mini line 已實現通線，公司Ⅱ代 SiC 芯片已在 8 寸 mini line 上試流片成功，其參數與公司 6 寸產品匹配，良品率明顯高於 6 寸。士蘭集宏主廠房及其他建築物已全面封頂，正在進行淨化裝修，預計將在 2025 年 4 季度實現全面通線並試生產，以趕上 2026 年車用 SiC 市場的快速成長。
當前，在國家政策持續支持，以及下遊電動汽車、新能源、算力和通訊等行業快速發展、芯片國產替代進程明顯加快的大背景下，士蘭微電子將加快實施“一體化”戰略，持續加大對模擬電路、功率半導體、MEMS 傳感器、包括 SiC、GaN 在內的第三代化合物半導體等方面的投入，大力推進系統創新和技術整合，積極拓展汽車、新能源、工業、通訊、大型白電、電力電子等中高端市場，不斷提升產品附加值和產品品牌力，持續推動公司整體營收的較快成長和經營效益的提升，努力爲國家集成電路產業發展做出貢獻。
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