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又一併購重組!兩家半導體“小巨人”強強聯合,瞄準國產替代大機會
格隆匯 03-13 11:22

近期,半導體企業出手頻頻,併購重組大動作不斷。

解決半導體封裝材料“卡脖子”問題,華海誠科擬以11.2億元收購衡所華威70%股權,實現對其的完全控股。

今日,華海誠科開盤拉昇,一度漲近4%,後有所回落,翻綠微跌,最新報86.23元/股,總市值69.58億元。

自去年9月24日以來,華海誠科股價一度翻倍,最高報103元/股,近11個交易日回撤超12%。

16億元合併

3月12日晚,華海誠科公佈,擬通過發行股份、可轉換公司債券及支付現金的方式購買紹興署輝等13名股東持有的衡所華威70%股權並募集配套資金,交易價格11.2億元。

根據交易方案,華海誠科將以56.35元/股的發行價格,向紹興署輝、上海衡所等部分交易對方發行股份567.88萬股,支付股份對價3.2億元;向煒岡科技、丹陽盛宇等交易對方發行可轉債479.99萬張(面值100元/張),支付對價4.8億元;另以現金支付3.2億元。

配套募資的8億元中,3.2億元用於支付現金對價,其餘資金投向芯片級封裝材料生產線技術改造、車規級芯片封裝材料智能化生產線建設、先進封裝用塑封料智能生產線建設、研發中心升級及補充流動資金等。

此前,華海誠科已經以4.8億元的價格收購了衡所華威30%股權。

因此,此次交易完成後,華海誠科將持有衡所華威100%股權,衡所華威將成爲華海誠科的全資子公司。

兩家“小巨人”強強聯合

資料顯示,華海誠科是專注於半導體芯片封裝材料的研發及產業化的國家級專精特新“小巨人”企業,主要產品爲環氧塑封料和電子膠黏劑。

而衡所華威是一家從事半導體芯片封裝材料研發、生產和銷售的國家級專精特新“小巨人”企業。

衡所華威及其前身已深耕半導體芯片封裝材料領域四十餘年,系國內首家量產環氧塑封料的廠商,後期融合了德國和韓國的技術, 擁有世界知名品牌“Hysol”。

衡所華威的客戶包括一批全球知名的半導體企業,如安世半導體、日月新、艾維克斯、基美、意法半導體、安森美、德州儀器、威世等國際半導體領先企業以及長電科技、通富微電、華天科技、華潤微等國內半導體封測龍頭企業,同時打入英飛凌、力特、士蘭微等供應體系。

合併衡所華威後,華海誠科在半導體環氧塑封料領域的年產銷量有望突破2.5萬噸,穩居國內龍頭低位,躍居全球出貨量第二位。

據介紹,環氧塑封料是半導體產業中關鍵性的基礎材料,高性能尤其是先進封裝用環氧塑封料目前主要由外資廠商壟斷,依賴進口,長期屬於“卡脖子”產品,國產替代空間大。

隨着半導體需求的增加,環氧塑封料市場增長空間較大。

根據SEMI的數據,預計2024年全球半導體材料市場將小幅增長0.17%,市場規模約668.4億美元。包封材料市場規模約35億美元,增長4.79%。據中國半導體支撐業發展狀況報告預測,2024年中國包封材料的市場規模約爲66.9億元,增長1.98%。

華海誠科併購衡所華威,有望通過強強聯合,共同努力攻堅,解決半導體封裝材料行業的“卡脖子”問題。

此外,雙發合併後的盈利能力有望進一步增強。

據公告,若以2024年前10個月兩家公司的財務數據測算,交易完成後,華海誠科總資產將從12.50億元增至30.12億元,增幅140.97%;營業收入、歸母淨利潤將分別提升至6.56億元、5714.05萬元,較收購之前增長146.57%、46.95%。

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