斯瑞新材(688102.SH):公司將新型銅合金應用於光模塊殼體,解決行業技術痛點
格隆匯2月21日丨斯瑞新材(688102.SH)近日在接待機構投資者調研時表示,公司是一家新材料研發製造企業,產品主要服務於軌道交通、航空航天、電力電子、醫療影像、新能源汽車、人工智能等領域。
400G以上光模塊芯片對散熱要求大幅提高,需要具有低膨脹更高導熱特性的新材料來滿足要求,不同成份的鎢銅合金可以滿足400G、800G、1.6T光模塊需求。用於光模塊芯片基座的鎢銅材料主要技術要求是超細鎢粉均勻彌散分佈在銅相中,並且材料要求高潔淨度、高緻密度,不允許有任何氣孔、夾雜、鎢顆粒團聚,這些缺陷都會嚴重影響光模塊組件焊接和使用性能。公司採用3D打印骨架、真空熔滲定向凝固、微精密加工、自建專用鍍金線滿足了這一細分市場的特殊需求。
同時,隨着光芯片對散熱要求的大幅提高,要求殼體材料具有更高的導熱和力學性能,公司將新型銅合金應用於光模塊殼體,解決行業技術痛點。
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