芯聯集成(688469.SH):激光雷達核心芯片VCSEL以及微振鏡芯片進入規模量產
格隆匯11月27日丨芯聯集成(688469.SH)在互動平台表示,公司產品主要包括應用於車載、工控、高端消費領域的功率控制、功率驅動、傳感信號鏈等方面核心芯片及模組,為汽車、新能源、工控、家電等領域提供完整的系統代工解決方案。公司堅持高水平的技術研發投入,持續引進高端技術人才,配備國際先進技術資源,不僅在晶圓製造工藝進行大力的研發,並向模組封裝領域進行延伸,助力芯片行業的集成化發展,成功推出了新產品,獲得了多個重大客户定點。 (1)汽車電子方面:電動化方面:功率半導體特別是先進SiC芯片及模塊進入規模量產;車載模擬IC推出多個國內領先、全球先進的技術平台,填補國內高壓大功率數字模擬混合信號集成IC的空白。智能化方面:激光雷達核心芯片VCSEL以及微振鏡芯片進入規模量產;多個傳感器項目包括高精度慣性導航傳感器、壓力傳感器、高性能車載麥克風進入智能汽車終端,全面助力汽車智能化的發展。(2)工業控制方面:AI服務器、數據中心等應用方向:發佈了面向數據中心服務器的55納米高效率電源管理芯片平台技術並獲得重大項目定點。風光儲充方向:為全球風光儲充頭部企業提供高功率、高可靠性、高穩定性的功率半導體IGBT,SiC芯片及模塊。智能電網方向:特高壓直流輸電的核心器件超高壓IGBT 產品已實現量產。(3)消費電子方面:手機以及可穿戴應用領域:公司傳感器和電池管理保護產品已經佔據市場和技術領先位置,推出了高性能麥克風平台;同時推出應用於消費領域的低壓40V BCD以及數模混合技術平台,實現規模量產。家電應用領域:推出全系列智能功率模塊產品,實現多個重大客户突破,進入規模量產。
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