嘉元科技(688388.SH):超薄UTF銅箔可應用於芯片領域
格隆匯11月27日丨嘉元科技(688388.SH)在互動平台表示,甚低輪廓HVLP銅箔多應用於高頻高速線路板,超薄UTF銅箔可應用於芯片領域。近年來,我司為加強在高端電子電路銅箔領域佈局,推動高端電子電路銅箔的國產替代進程,取得了高階RTF銅箔、HTE銅箔、IC封裝極薄銅箔、HVLP銅箔及HDI銅箔等高端電子電路銅箔的技術突破。
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