壹石通(688733.SH):現階段已量產的芯片封裝填料以Low-α球硅為主
格隆匯11月22日丨壹石通(688733.SH)在投資者互動平台表示,公司高端芯片封裝用Low-α球形氧化鋁產品的規劃年產能為200噸,目前在與下游日韓用户開展多批次驗證導入工作。 根據下游客户近期反饋的情況,現階段已量產的芯片封裝填料以Low-α球硅為主,而Low-α球鋁的現階段用量相對較少,處於量產應用的前期評測階段。基於下游終端用户針對封裝環節(不侷限於HBM)導熱散熱性能提升的需求,以Low-α球鋁作為封裝填料可以兼顧導熱及低α射線需求。但考慮產業鏈條、差異化復配、成本控制及驗證週期,下游大批量使用的節奏會比較慢,部分客户反饋其達到每月十噸級的採購量可能需要較長時間。
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