廣信材料(300537.SZ):在光刻膠及配套材料板塊,公司目前還是基於PCB光刻膠的優勢基礎領域逐步向光伏、顯示半導體等泛半導體領域發展
格隆匯11月6日丨廣信材料(300537.SZ)在投資者互動平台表示,在光刻膠及配套材料板塊,公司目前還是基於PCB光刻膠的優勢基礎領域逐步向光伏、顯示半導體等泛半導體領域發展,其中目前仍然以PCB光刻膠及新增的光伏膠為主顯示半導體為輔的優先次序,夯實PCB光刻膠基本盤,順應並抓好光伏新技術的新市場機遇,進一步強化公司光刻膠及配套材料在PCB、光伏等泛半導體領域的優勢地位,根據市場及公司實際情況適度適時發展其他半導體領域!
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