深南電路(002916.SZ):FC-BGA封裝基板已具備16層及以下產品批量生產能力,16層以上產品具備樣品製造能力
格隆匯9月18日丨深南電路(002916.SZ)於2024年9月18日接受特定對象調研,就“請介紹公司封裝基板業務在FC-BGA技術能力方面取得的進展”,公司表示,公司FC-BGA封裝基板已具備16層及以下產品批量生產能力,16層以上產品具備樣品製造能力。公司後續將進一步加快高階領域產品技術能力突破和市場開發,同時也將繼續引入該領域的技術專家人才,加強研發團隊培養,提升鞏固核心競爭力。
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