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芯聯集成(688469.SH):計劃於下半年推出高可靠性、高性能專用MCU平台
格隆匯 09-10 19:51

格隆匯9月10日丨芯聯集成(688469.SH)在投資者關係活動上表示,上半年,隨着市場需求的復甦,伴隨芯片國產化的大趨勢,公司8英寸硅基產品線產能利用率飽滿;SiC晶圓產線、12英寸硅基晶圓產線及對應的模組產線產能及產能利用率顯著提升。公司已經佈局了三條核心增長曲線,覆蓋不同的產品領域和應用方向。各增長曲線的循環協同效應和相互促進效果,保障了公司未來在營收上的持續穩定增長。公司將繼續堅持技術+市場雙輪驅動的策略,推動三條增長曲線共同成長。公司將在已經具備領先優勢的產品線MEMS、IGBT、SiCMOSFET、BCD、VSCEL、功率模組等方面,持續進行市場的開拓和技術的迭代,實現技術趕超,擴大市場份額,並積極進入海外市場;進一步重點發展高壓模擬集成芯片新工藝技術平台,為廣大產品公司打造有競爭力的國產模擬集成芯片提供最優質的代工製造平台。同時,公司還將不斷拓展新產品線,計劃於下半年推出高可靠性、高性能專用MCU平台;也將不斷拓寬業務領域,全面佈局高增長的AI高速服務器領域,為AI服務器電源,AI集羣通信等多個AI系統提供完整的電源管理芯片和模組的代工服務,為產品公司打造國內AI服務器電源代工方案提供技術支撐和大規模高質量交付保障。預計公司收入將繼續保持增長的良好態勢。

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