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興森科技(002436.SZ):FCBGA封裝基板目前已具備20層及以下產品的量產能力
格隆匯 08-14 17:36

格隆匯8月14日丨興森科技(002436.SZ)於投資者互動平台表示,公司FCBGA封裝基板是芯片封裝的原材料,芯片設計公司和封裝廠商均為公司目標客户。公司FCBGA封裝基板目前已具備20層及以下產品的量產能力,最小線寬線距達9/12um,最大產品尺寸為1120*120mm,低層板良率超90%,高層板良率超85%。FCBGA封裝基板項目前期建設階段的成本負擔是必經階段,公司將繼續按計劃推進客户拓展及量產工作。

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