燦勤科技(688182.SH):數款陶瓷基板已完成小批量交付驗證
格隆匯8月8日丨燦勤科技(688182.SH)在投資者互動平台表示,截至2023年12月31日,公司已完成微波SIP、微波功率管殼、CMOS、光通信、光耦合器封裝、CPGA、CBGA、CQFN、CLCC、 CSOP、CQFP等系列封裝產品的開發和送樣;部分產品已取得客户認可,開始小批量交付使用。在陶瓷基板產品形態領域,公司數款陶瓷基板已完成小批量交付驗證。公司控股子公司頻普半導體目前已具備薄膜電路及相關薄膜MEMS無源器件的批量生產能力,部分毫米波薄膜無源器件已經開始批量生產,後續進展情況請您關注公司公吿。
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