聯得裝備(300545.SZ):已經憑藉研發成功的半導體IC封裝設備順利切入半導體封測行業
格隆匯8月1日丨聯得裝備(300545.SZ)於投資者互動平台表示,公司積極佈局半導體領域,已經憑藉研發成功的半導體IC封裝設備順利切入半導體封測行業。在先進封裝領域公司有針對顯示驅動芯片鍵合設備,COF倒裝設備,該倒裝設備是一種採用共晶+倒裝的芯片鍵合工藝的高精度高速度先進封裝設備。公司將積極創造並把握半導體設備領域的發展機遇,加快推進半導體設備領域的技術研發和市場開拓,努力實現業務快速發展。
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