深南電路(002916.SZ):公司FC-BGA封裝基板14層及以下產品公司現已具備批量生產能力
格隆匯7月15日丨深南電路(002916.SZ)在投資者互動平台表示,公司FC-BGA封裝基板14層及以下產品公司現已具備批量生產能力,14層以上產品具備樣品製造能力。各階產品對應的產線驗證導入、送樣認證等工作有序推進中。公司面向FC-BGA等基板產品的廣州封裝基板項目一期已於2023年第四季度連線投產,目前尚處於產能爬坡階段。在產能爬坡過程中,前期投入形成的資產或費用已開始折舊、攤銷,但因產量有限,單位產品分攤的固定成本較高,因此會對公司利潤造成一定的負向影響。
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