泰凌微(688591.SH):預計TLSR925x芯片將於2024年內實現批量生產
格隆匯7月3日丨泰凌微(688591.SH)公佈,TLSR925x系列SoC是公司高性能、低功耗、多協議、高集成度無線連接芯片家族的最新一代產品,能夠滿足未來高性能物聯網終端產品對於低碳、融合、安全以及智能等各方面更為嚴苛的需求。該芯片是國內首顆實現工作電流低至1mA量級的多協議物聯網無線SoC(實測結果),在市場同類產品中實現了里程碑的突破。TLSR925x在單個芯片上同時支持藍牙低功耗和基於IEEE802.15.4的無線通信技術,並支持各類上層協議標準的最新版本。此外,該芯片支持先進的安全特性,幫助終端產品符合全球目標市場日益提升的安全准入要求。
公司TLSR925x後續主要聚焦的是以Matter為代表且支持多協議以及有更高安全要求的各類智能家居設備,同時將開拓血壓計、血糖儀、電視、機頂盒遙控器、智能手環、工業傳感以及資產物項定位等對功耗要求更高的細分領域市場。公司預計該芯片將於2024年內實現批量生產,並在近期開始為先導客户進行開發和提供樣品。
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