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眾合科技(000925.SZ):擁有完整的半導體硅片製備工藝和 3-8 尺寸的硅片生產線,可實現從晶體生長、切片、研磨、拋光的全鏈條生產
格隆匯 06-20 15:38

格隆匯6月20日丨眾合科技(000925.SZ)在投資者互動平台表示,根據世界半導體貿易統計組織(WSTS),2023年下半年以來消費電子景氣度回暖,工控、汽車、光儲總體平穩,上游功率半導體相關產品率先受益,半導體材料需求有望於2024年迎來需求拐點。海納在硅材料領域持續進行研發投入和生產實踐,始終保持產品核心技術的競爭優勢。公司擁有完整的半導體硅片製備工藝和 3-8 尺寸的硅片生產線,可實現從晶體生長、切片、研磨、拋光的全鏈條生產。多年來憑藉着高質量的產品品質和高客户粘性,尤其是在中小尺寸硅片中高端的細分領域具有技術和市場的雙重領先性。在拋光片領域,海納子公司日本松崎已經是東芝、富士電機、瑞薩電子等全球知名企業的穩定供應商,已在中小尺寸硅片市場形成較強的競爭力。主要競爭對手為滬硅產業、立昂微和中晶科技等。

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