江波龍(301308.SZ):不具備CoWos的成熟技術
格隆匯6月19日丨江波龍(301308.SZ)在投資者互動平台表示,CoWoS(Chip-on-Wafer-on-Substrate)是一種2.5D封裝技術。這種技術允許多個小芯片(或稱為芯片裸片)封裝到一個基板上,從而實現更高的集成度、增強的芯片間互聯性和降低功耗。CoWos主要由台積電開發,目前在存儲芯片封裝領域,主要應用於HBM產品,同時也用於CPU/GPU。但是,對於公司主要從事的NAND Flash產品而言,CoWos尚未普遍性應用。所以,公司亦不具備CoWos的成熟技術,但公司對包括CoWos在內的先進封裝技術均保持着關注及瞭解。
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