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利亞德(300296.SZ):今年下半年將推出50μm以下無襯底芯片的Micro產品
格隆匯 06-05 09:20

格隆匯6月5日丨利亞德(300296.SZ)接受特定對象調研時表示,Micro LED 是公司的戰略產品,目前可量產的 Micro LED,為 PCB 基MIP 封裝形式,既包括單像素封裝的"黑鑽",也包括集成式 LED 封裝的"Nin1"; 今年下半年,公司將推出 50μm 以下無襯底芯片的 Micro 產品,間距擴展到 0.3mm,從而可完全滿足商用及高端家用顯示的使用需求。

自 2020 年落地 Micro 量產以來,公司主推的技術路徑就是 MIP。這幾年,公司圍繞 Micro 不斷在做產品升級和成本優化,未來隨着芯片尺寸不斷縮小,MIP 的優勢將體現得更加明顯。現階段,公司也將採用 OEM 方式推出 COB 封裝形式的 Micro LED 模組,製成 Micro LED 顯示產品,來滿足客户不同的需求。

此外,公司也在與業內面板公司共同研發 COG Micro LED 產品,通過更換基板來進一步降低成本,打開市場。

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