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雷曼光電(300162.SZ):公司的新型PM驅動玻璃基封裝技術主要用於MicroLED顯示面板封裝
格隆匯 05-20 19:37

格隆匯5月20日丨雷曼光電(300162.SZ)公佈股票交易異常波動公吿近日,玻璃基板概念受到市場資金的關注,據市場信息,英偉達GB200採用的先進封裝工藝將使用玻璃基板;此外,英特爾、三星、AMD、蘋果等大廠此前均表示將導入或探索玻璃基板芯片封裝技術。公司經自查:前述信息中的玻璃基板封裝技術,是指用玻璃基載板替代傳統有機聚合物載板進行半導體芯片封裝,屬於半導體芯片封裝領域的應用。公司的新型PM驅動玻璃基封裝技術主要用於MicroLED顯示面板封裝,不能用於半導體芯片封裝,同時,公司的PM驅動玻璃基顯示產品的技術和工藝正在不斷提升和完善,目前階段尚未形成收入。

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