聯得裝備(300545.SZ):在半導體領域主要生產半導體後段工序的封裝測試設備
格隆匯5月10日丨聯得裝備(300545.SZ)近日在接待機構投資者調研時表示,公司在半導體領域主要生產半導體後段工序的封裝測試設備。主要產品是COF倒裝機、半導體倒裝機、軟焊料固晶機、共晶固晶機、AOI檢測機、引線框架貼膜機等高速高精的半導體裝備。公司將加快在半導體領域的技術研發和市場開拓,提高綜合競爭力,努力實現業務快速增長。
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