長電科技(600584.SH):與國內外客户就CPO光電合封產品進行了多年的技術合作
格隆匯3月20日丨長電科技(600584.SH)在投資者互動平台表示,長電科技針對高性能計算系統推出了一站式解決方案,具有完整的專利技術佈局,全套設備產能支持,和持續更新的技術產品路線圖,覆蓋了計算,存儲,電源及網絡相關芯片的封裝需求。在計算領域,長電科技已經於2021年推出了多維扇出封裝集成的XDFOI技術平台,並持續推進多樣化方案的研發及量產,以及在海內外工廠的相關產能佈局,可覆蓋當前市場上的主流2.5D Chiplet方案。對於存儲領域,長電科技具備超薄芯片封裝,助力系統的小型化解決方案。同時公司推出的XDFOI高性能封裝技術平台可以支持高帶寬存儲的封裝要求。公司已於近期宣佈收購晟碟半導體(上海)有限公司80%股權,旨在進一步加強公司在存儲領域的技術及產能佈局。對於高性能計算髮展所帶動的電源管理需求,長電科技具備完備的功率器件封裝技術和量產經驗,覆蓋碳化硅(SiC)、氮化鎵(GaN)等新材料功率器件及多種分立和芯片級封裝,並在散熱和可靠性上擁有多項專利技術,開發了多種散熱結構。通過與頭部用户緊密合作,公司已在服務器供電模塊技術及製造上積累了豐富的經驗。對於網絡模塊,長電科技與國內外客户就CPO光電合封產品進行了多年的技術合作。
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