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博眾精工(688097.SH):目前已推出芯片後道封裝AOI檢測機等
格隆匯 03-14 15:37

格隆匯3月14日丨博眾精工(688097.SH)在投資者互動平台表示,公司在半導體板塊的佈局主要是從後道的封裝測試設備入手,然後再往前道的晶圓AOI檢測設備延伸,目前公司已經推出芯片後道封裝AOI檢測機、全自動高精度共晶機、高速高精度固晶機、清洗機設備,相關產品已實現了銷售,在客户現場取得較好的使用效果,客户反饋正向。

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