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迴天新材(300041.SZ):在芯片封裝用膠板塊系列產品包括芯片級底部填充膠(環氧、有機硅)等
格隆匯 01-05 09:13

格隆匯1月5日丨迴天新材(300041.SZ)披露投資者關係活動記錄表顯示,公司在芯片封裝用膠板塊系列產品包括芯片級底部填充膠(環氧、有機硅)、芯片模塊綁定膠、Lid粘接材料、芯片級導熱界面材料、SiP電磁屏蔽銀漿、芯片導電銀膠等,在芯片及PCB板方面批量供應的產品主要用在板級保護與連接方面,如三防漆、電磁屏蔽、散熱等材料,其中板級材料三防漆上量較快。目前相關產品已經在H公司、歐菲等通信電子、消費電子行業標杆客户處廣泛驗證、推廣應用和上量。

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