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沃格光電(603773.SH):具備玻璃基板級封裝載板技術 目前具備小批量產品供貨能力
格隆匯 12-05 08:43

格隆匯12月5日丨有投資者在投資者互動平台向沃格光電(603773.SH)提問,“請問公司的tgv技術能否用於目前大火的HBM概念?”

公司表示,公司具備玻璃基板級封裝載板技術,且目前具備小批量產品供貨能力,並且提前做了一定的新建產能佈局。公司擁有的玻璃基板級封裝載板產品採用TGV巨量微通孔技術,可以實現各類芯片包括存儲芯片的多層堆疊(2.5D/3D垂直封裝),同時玻璃基鍍銅通孔技術可以根據不同封裝基板產品形態需求進行結構設計,以滿足不同類型芯片封裝和連接需求,目前公司基於TGV技術多個項目處於合作開發驗證階段,部分產品通過客户驗證通過,具體量產情況以及產品應用形態請以公司公吿為準,並注意投資風險。

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