德邦科技(688035.SH):公司芯片級底填、AD膠、TIM1、DAF/CDAF膜等這幾個材料目前整體上還處於驗證導入初期階段
格隆匯9月8日丨德邦科技(688035.SH)接受特定對象調研時表示,公司芯片級底填、AD膠、TIM1、DAF/CDAF膜等這幾個材料目前整體上還處於驗證導入初期階段,公司今年的主要目標是這幾個產品能夠通過較多客户的驗證。AD膠、固晶膜(DAF)已經開始供貨,但訂單量還比較小,對我們來説的意義在於實現了從0到1的突破,幾個系列產品今年的預期大概是大幾百萬的量,明年增量增長的機會比較多。
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