博眾精工(688097.SH):高速高精度固晶機和新一代芯片外觀檢測AOI設備預計年底前均會有樣機提供客户試用
格隆匯8月11日丨博眾精工(688097.SH)近期在接待機構投資者調研時表示,公司在半導體業務板塊目前有三款產品,分別是:高精度共晶貼片機、高速高精度固晶機和芯片外觀檢測AOI設備。高精度共晶貼片機已有成熟產品交付給客户使用,後續訂單也在洽談之中。高速高精度固晶機和新一代芯片外觀檢測AOI設備研發進展順利,預計年底之前均會有樣機提供客户試用。
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