隆揚電子(301389.SZ):未來將以卷對卷真空磁控濺射技術為技術核心,形成“電磁屏蔽+複合銅箔”雙輪驅動模式
格隆匯8月1日丨有投資者向隆揚電子(301389.SZ)提問,“請問公司在2014年制訂的十年計劃馬上就要到期了,祝賀公司成功地實現了過去的十年計劃,請問接下來的十年計劃已經在制訂中了嗎?具體是什麼有沒有可能透露下。畢竟現在規模、行業地位與資金實力均不同了,原有的產品與行業也面臨增長與滲透率到了一定的高度。”
隆揚電子回覆稱,公司於2022年10月上市;未來公司將以卷對卷真空磁控濺射技術為技術核心,形成“電磁屏蔽+複合銅箔”雙輪驅動模式,拓展更多市場領域,讓公司不斷良性發展。
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