新萊應材(300260.SZ):半導體產品使用量約佔芯片廠總投入3%-5%左右
格隆匯7月24日丨新萊應材(300260.SZ)在7月21日投資者關係活動上表示,根據公司經驗積累,公司半導體產品使用量約佔芯片廠總投入3%—5%左右,約佔半導體設備廠原材料採購額的5%—10%,半導體行業產品的對標的競爭對手以美國、日本等國家的外資企業為主,該業務產品的市場空間超過500億人民幣。根據QYResearch統計,預計2023年全球無菌包裝市場規模將達到184.88億美元。
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