興森科技(002436.SZ):多芯片FCBGA,多層FCBGA,2.3/2.5D封裝等對FCBGA封裝基板的要求是類似的,公司均具備相關能力
格隆匯7月18日丨有投資者向興森科技(002436.SZ)提問,“目前先進的封裝技術大多都會使用FC-BGA封裝,而公司正在着力發展這一項目,公司是否具備生產多芯片FC-BGA,多層FC-BGA,無芯FC-BGA,2.3/2.5D封裝FC-BGA的能力,HBM為主要代表的存算一體芯片能夠通過2.5D/3D堆疊,將多個存儲芯片與處理器芯片封裝在一起,公司是否具備這一封裝基板的生產能力。”
興森科技回覆稱,多芯片FCBGA,多層FCBGA,2.3/2.5D封裝等對FCBGA封裝基板的要求是類似的,公司均具備相關能力。無芯板FCBGA封裝基板和有芯板FCBGA封裝基板的芯板製作工藝流程不同,公司雖具備無芯板基板的生產能力,但目前因無相關客户需求,未計劃在FCBGA封裝基板中採用無芯板技術。公司的技術發展方向和產品規劃將根據市場和客户需求進行佈局和調整。
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